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Job Opportunities
新製程技術開發技術部級主管

1. Fan-out & TSV evaluation for future 3~5 years business(30%)  Survey & evaluate and implement Fan-out, TSV;Proposal for solution build up by internal RD, license or OEM
2. BKM survey and process flow define & control plan for wafer level package (WLCSP, Fan-out & TSV) (20%)
3. Support to do revers engineering (20%) Revers engineering for competition analysis,and process integration ofwafer level package (WLCSP, Fan-out & TSV).
4. Direct material(PI/PBO/Plated Metal) benchmarking & suggestion for wafer level package.(30%)