- Proposal for package selection of new business evaluation
- Survey & evaluate and implement advanced package solution;(Solution scope included in Fan-out, TSV, FC Hybrid & simple 3D)
- Initial BKM survey and process flow define & control plan generate for advanced package(wafer level, assembly) solution
- Revers engineering
- Direct material(PI/PBO/Plated Metal/Underfill/EMC and substrate) benchmarking & suggestion for wafer level package & flip chip assembly.