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Job Opportunities
Process Manager / Director
  • Proposal for package selection of new business evaluation
  • Survey & evaluate and implement advanced package solution;(Solution scope included in Fan-out, TSV, FC Hybrid & simple 3D)
  • Initial BKM survey and process flow define & control plan generate for advanced package(wafer level, assembly) solution
  • Revers engineering
  • Direct material(PI/PBO/Plated Metal/Underfill/EMC and substrate) benchmarking & suggestion for wafer level package & flip chip assembly.